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INDEX
MX23C3210
32M-BIT MASK ROM (8/16-BIT OUTPUT)
FEATURES
* Bit organization - 4M x 8 (byte mode) - 2M x 16 (word mode) * Fast access time - Random access: 100ns (max.) * Current - Operating:60mA - Standby:100uA * Supply voltage - 5V10% * Package - 44 pin SOP (500mil) - 48 pin TSOP (20mm x 12mm) - 42 pin DIP (600 mil) (word mode)
ORDER INFORMATION
Part No. MX23C3210MC-10 MX23C3210MC-12 MX23C3210MC-15 MX23C3210TC-10 MX23C3210TC-12 MX23C3210TC-15 MX23C3210RC-10 MX23C3210RC-12 MX23C3210RC-15 MX23C3210PC-10 MX23C3210PC-12 MX23C3210PC-15 Access Time 100ns 120ns 150ns 100ns 120ns 150ns 100ns 120ns 150ns 100ns 120ns 150ns Package 44 pin SOP 44 pin SOP 44 pin SOP 48 pin TSOP 48 pin TSOP 48 pin TSOP 48 pin TSOP (Reverse type) 48 pin TSOP (Reverse type) 48 pin TSOP (Reverse type) 42 pin DIP 42 pin DIP 42 pin DIP
PIN CONFIGURATION
44 SOP
NC A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 CE/CE VSS OE/OE D0 D8 D1 D9 D2 D10 D3 D11 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23
42 DIP (For Word Mode Only)
A20 A19 A8 A9 A10 A11 A12 A13 A14 A15 A16 BYTE VSS D15/A1 D7 D14 D6 D13 D5 D12 D4 VCC
A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 CE/CE VSS OE/OE D0 D8 D1 D9 D2 D10 D3 D11 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 A19 A8 A9 A10 A11 A12 A13 A14 A15 A16 A20 VSS D15 D7 D14 D6 D13 D5 D12 D4 VCC
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
PIN DESCRIPTION
Symbol A0~A20 D0~D14 D15/A-1 CE/CE OEOE Byte VCC VSS NC Pin Function Address Inputs Data Outputs D15 (Word Mode)/ LSB Address (Byte Mode) Chip Enable Input Output Enable Input Word/ Byte Mode Selection Power Supply Pin Ground Pin No Connection
MX23C3210
MODE SELECTION
CE/CE L/H H/L H/L H/L OE/OE X L/H H/L H/L Byte X X H L D15/A-1 X X Output Input D0~D7 High Z High Z D0~D7 D0~D7 D8~D15 High Z High Z D8~D15 High Z Mode Word Byte Power Stand-by Active Active Active
P/N:PM0247
MX23C3210
REV. 2.8, FEB. 01, 1999
1
INDEX
MX23C3210
48 TSOP (Normal Type)
BYTE A16 A15 A14 A13 A12 A11 A10 A9 A8 A19 VSS A20 A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 CE/CE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 VSS VSS D15/A-1 D7 D14 D6 D13 D5 D12 D4 VCC VCC NC D11 D3 D10 D2 D9 D1 D8 D0 OE/OE VSS VSS
48 TSOP (Reverse Type)
VSS VSS D15/A-1 D7 D14 D6 D13 D5 D12 D4 VCC VCC NC D11 D3 D10 D2 D9 D1 D8 D0 OE/OE VSS VSS 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 BYTE A16 A15 A14 A13 A12 A11 A10 A9 A8 A19 VSS A20 A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 CE/CE
MX23C3210 (Normal Type)
MX23C3210 (Reverse Tpye)
BLOCK DIAGRAM
A0/(A-1) A20 CE BYTE OE
Address Buffer
Memory Array
Sense Amplifier
Word/ Byte
Output Buffer
D0 D15/(D7)
ABSOLUTE MAXIMUM RATINGS
Item Voltage on any Pin Relative to VSS Ambient Operating Temperature Storage Temperature Symbol VIN Topr Tstg Ratings -0.5V to 7.0V 0C to 70C -65C to 125C
P/N:PM0247
REV. 2.8, FEB. 01, 1999
2
INDEX
MX23C3210
DC CHARACTERISTICS (Ta = 0C ~ 70C, VCC = 5V10%)
Item Output High Voltage Output Low Voltage Input High Voltage Input Low Voltage Input Leakage Current Output Leakage Current Operating Current Standby Current (TTL) Standby Current (cmos) Input Capacitance Output Capacitance Symbol VOH VOL VIH VIL ILI ILO ICC1 ISTB1 ISTB2 CIN COUT MIN. 2.4V 2.2V -0.3V MAX. 0.4V VCC+0.3V 0.8V 5uA 5uA 60mA 1mA 100uA 10pF 10pF Conditions IOH = -1.0mA IOL = 2.1mA
0V, VCC 0V, VCC tRC = 100ns, all output open CE = VIH CE>VCC-0.2V Ta = 25C, f = 1MHZ Ta = 25C, f = 1MHZ
AC CHARACTERISTICS (Ta = 0C ~ 70C, VCC = 5V10%)
Item Read Cycle Time Address Access Time Chip Enable Access Time Output Enable Time Output Hold After Address Output High Z Delay Symbol tRC tAA tACE tOE tOH tHZ 23C3210-10 MIN. MAX. 100ns 100ns 100ns 50ns 0ns 20ns 23C3210-12 MIN. MAX. 120ns 120ns 120ns 60ns 0ns 20ns 23C3210-15 MIN. MAX. 150ns 150ns 150ns 70ns 0ns 20ns
Note:Output high-impedance delay (tHZ) is measured from OE going high, and this parameter guaranteed by design over the full voltage and temperature operating range - not tested.
P/N:PM0247
REV. 2.8, FEB. 01, 1999
3
INDEX
MX23C3210
AC Test Conditions
Input Pulse Levels Input Rise and Fall Times Input Timing Level Output Timing Level Output Load 0.4V~2.4V 10ns 1.5V 0.8V and 2.0V See Figure
IOH (load)=-1mA DOUT IOL (load)=2.1mA
C<100pF
Note:No output loading is present in tester load board. Active loading is used and under software programming control. Output loading capacitance includes load board's and all stray capacitance.
TIMING DIAGRAM
RANDOM READ
ADD
ADD tACE
ADD tRC
ADD
CE
OE
tOE tOH VALLID tHZ VALLID
tAA DATA VALLID
P/N:PM0247
REV. 2.8, FEB. 01, 1999
4
INDEX
MX23C3210
PACKAGE INFORMATION
42-PIN PLASTIC DIP(600 mil)
ITEM A B C D E F G H I J K L M
NOTE:
MILLIMETERS 52.54 max. 0.76 [REF] 2.54 [TP] .46 [Typ.] 50.76 1.27 [Typ.] 3.30 . 25 .51 [REF] 3.94 . 25 5.33 max. 15.22 .25 13.97 .25 .25 [Typ.]
INCHES 2.070 max. .030 [REF] .100 [TP] .018 [Typ.] 2.000 .050 [Typ.] .130 .010 .020 [REF] .155 .010 .210 max. .600 .010 .550 .010 .010 [Typ.]
F D E C B M 0~15 I H J G 1 A 21 K L 42 22
Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition.
44-PIN PLASTIC SOP
ITEM A B C D E F G H I J K L
MILLIMETERS 28.70 max. 1.10 [REF] 1.27 [TP] .40 .10 [Typ.] .010 min. 3.00 max. 2.80 .13 16.04 .30 12.60 1.72 .15 .10 [Typ.] .80 .20
INCHES 1.130 max. .043 [REF] .050 [TP] .016 .004 [Typ.] .004 min. .118 max. .110 .005 .631 .012 .496 .068 .006 .004 [Typ.] .031 .008
D C B G F K E L 1 A 22 H I J 44 23
NOTE: Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition.
P/N:PM0247
REV. 2.8, FEB. 01, 1999
5
INDEX
MX23C3210
48-PIN PLASTIC TSOP
ITEM A B C D E F G H I J K L M N
NOTE:
MILLIMETERS 20.0 .20 18.40 .10 12.20 max. 0.15 [Typ.] .80 [Typ.] .20 .10 .30 .10 .50 [Typ.] .45 max. 0 ~ .20 1.00 .10 1.27 max. .50 0 ~ 5
INCHES
A
.787 .008 .724 .004 .480 max. .006 [Typ.] .031 [Typ.] .008 .004 .012 .004 .020 [Typ.] .018 max. 0 ~ .008 .039 .004 .050 max. .020 .500
B
C
N M
K D E F G H I J
L
Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition.
P/N:PM0247
REV. 2.8, FEB. 01, 1999
6
INDEX
MX23C3210
REVISION HISTORY
Revision 2.6 Description Page Date
DC Characteristics: The input leakage current (ILI) is changed as 5uA instead of 10uA. The output leakage current (ILO) is changed as 5uA instead 10uA. The power down supply current (ISTB2) is changed as 100uA instead of 5uA. AC Characteristics: Added 100ns grade item, deleted 200ns grade item. The output enable time (tOE) is changed as 60ns instead of 70ns in 120ns grade item, and 70ns instead of 80ns grade item. The output high Z delay is changed as 20ns instead of 70ns.
2.7
MAR/25/1998
2.8
AC Characteristics: tOH 10ns --> 0ns
P3
FEB/01/1999
P/N:PM0247
REV. 2.8, FEB. 01, 1999
7
INDEX
MX23C3210
MACRONIX INTERNATIONAL CO., LTD.
HEADQUARTERS:
TEL:+886-3-578-8888 FAX:+886-3-578-8887
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TEL:+1-408-453-8088 FAX:+1-408-453-8488
CHICAGO OFFICE:
TEL:+1-847-963-1900 FAX:+1-847-963-1909
http : //www.macronix.com
MACRONIX INTERNATIONAL CO., LTD. reserves the rignt to change product and specifications without notice.
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